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Project Management ~ Problem Solving ~ Data Analysis
Root Cause Analysis ~ Team Leadership ~ Process Improvements
Demonstrated success in project management, data gathering and analysis, product development, safety compliance, team collaboration, and process development.
Ability to establish cooperative working relationships with all levels of an organization.
Highly skilled at defining and implementing processes to maximize product quality, cost containment, revenue growth, and profitability.
Consummate strengths in troubleshooting, decision-making, trend & statistical analysis, and budget preparation.
Proficient user of Microsoft Office Suite; able to compile and track critical data in Excel spreadsheets and JMP software.
Innovative, systematic, creative, and committed to quality assurance and control.
Exemplary abilities in failure analysis of systems and products, and thoroughly documenting procedures for resolution.
Silfex, Inc., a division of Lam Research, Eaton, OH, 2006 to Present
Functioned as technical owner and project coordinator in successful development and deployment of Rapid Atom Plasma (RAP) etching process for conditioning proprietary silicon carbide components used in plasma etch chambers within highly profitable conductor etch market.
Championed development of small-hole Electrode Discharge Machining solution which is capable of drilling over one million precision holes in silicon electrodes annually, while adhering to Six Sigma criteria.
Extensively support Rapid Prototype Machining operations involving time-sensitive development and shipment within 24-hour window of receipt of order.
Methodically translate custom drawings into production work instructions for Rapid Prototype Machining, and join forces with production and management to ensure prototypes are manufactured to stringent print tolerances and timelines.
Formulated acid etching system for highly-specialized silicon electrodes and instituted process capable of targeting etch removals in next-generation silicon products with sub-micron tolerances.
Orchestrated project to transition high-volume manufactured silicon electrodes from manual etching process to innovative targeted process in fully-automated acid bench, resulting in company penetrating lucrative plasma etching market (3D NAND).
Resourcefully established YAG laser marking process for serializing silicon products, and leveraged SPC to stabilize marking depth by controlling laser output power.
Pioneered laser scribing process which slashed rework from more than 50% on some product groups to virtually zero.
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Charted process to slice Czochralski-grown (CZ) silicon crystals into electrode blanks via free abrasive wire saws, and assumed lead role in timely and budget-compliance installation of eight free abrasive wire saws.
Standardize and document work instructions, control plans, FMEAs methods, and process guidelines.
Apply solid leadership talents toward mentoring, supervising, instructing, and coaching numerous co-op students.
Closely partner with leadership team to devise capital budgets, yield budgets, and yield loss targets.
As integral member of Material Review Board, drive analysis and disposition of nonconforming materials, and determine corrective action to prevent future discrepancies.
Sumco USA, Maineville, OH, 1992 to 2006
Process Engineer 1999 to 2006
Engineered and supported silicon wafer fabrication processes including free abrasive wire saws, precision diamond wafer edge profiling, dimensional lapping, and wafer chemical etching and cleaning.
Shepherded project to replace antiquated fixed abrasive wafer slicing technology with free abrasive wire saws by authoring business case and project charter, determining equipment specifications, configuring first wire saw, and documenting process.
Trained, coached, and supervised production personnel to ensure seamless start-up, transition, and production operations.
Collaboratively converted manufacturing process from batch and queue system to lean manufacturing cells, accelerating product manufacturing cycle time from 26 days to five and decreasing required inventory by 80%+.
Process Technician 1992 to 1999
Project-managed planning, installation, testing, and qualification of state-of-the-art, fully-automated potassium hydroxide etching system.
Proficiently delivered comprehensive development support of chemical etching and cleaning procedures to optimize quality control and assurance outcomes.
Devised and administered process which facilitated controlled damage on silicon wafers, effectively removing unwanted impurities.
Investigated and revealed causes of multiple long-term yield loss issues, and resourcefully formulated successful solutions.
Evaluated, designed, and constructed in-house cleaning systems to considerably reduce associated expenses.
Demonstrated strict attention to accuracy in compiling work instructions, control plans, FEMA approaches, and process standards.
Prior background includes service with US Navy, San Diego, CA honorably discharged
Bachelor of Science , Electro-Mechanical Engineering
Miami University, Hamilton and Middletown, OH, 2015
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